AERVYNT AI delivers next-generation liquid cooling, high-density AI data center infrastructure and intelligent operational technologies across the GCC.
We help operators, sovereign compute platforms and enterprises deploy high-density infrastructure efficiently, reliably and at scale.
Direct-to-chip cooling, CDUs, manifolds and advanced thermal architectures for AI and HPC.
Engineering and integration for next-generation GPU clusters and AI-ready facilities.
Infrastructure designed to improve energy efficiency, resilience and future BESS integration.
Assessment, design, deployment, commissioning, monitoring and technical support.
Before investing millions in infrastructure, understand exactly what your facility can support.
Engineering assessment, target architecture, budget range and implementation roadmap.
Rack density • cooling capacity • power availability • facility loops • CDU requirements • retrofit options • energy efficiency • deployment CAPEX.
Commercial target: USD 15,000–30,000 depending on facility scope.
We select architecture around the customer's GPU platform, rack density, facility constraints, climate, CAPEX and energy requirements—not around one manufacturer's catalog.
An agentic procurement platform for manufacturers, distributors and infrastructure operators.
Supplier communication, quote comparison, PO acknowledgements, delivery tracking and exception management across email, documents and ERP workflows—with human approval gates.
Join Design Partner ProgramAERVYNT AI is evaluating partners in direct-to-chip cooling, CDUs, immersion, thermal management and AI data center infrastructure.
For UAE, Saudi Arabia and GCC opportunities, contact AERVYNT AI directly.
Shnypko Vladislav
Founder, AERVYNT AI
Litehouse Alfa General Trading LLC, Dubai, UAE
+971 55 267 1355